Heat dissipation measures for power boards with high-density implementation.
By implementing countermeasures, it is possible to address heat generation without changing the distance between both MOSFETs!
Recently, the implementation of power supply boards has been increasingly densified year by year. As a result, measures to address heat generation on power supply boards have become even more necessary. This time, I would like to focus on heat management in power supply boards with such high-density implementations. For example, let's assume that a low-heat-generating MOSFET for inrush current limiting is placed near a heat-prone MOSFET, such as those on the output side or in the PFC circuit. If one of the MOSFETs generates heat, the heat will also transfer to the other MOSFET. As a result, there is a risk that other devices nearby may experience thermal runaway or short-circuit failures, leading to malfunctions of the power supply board itself. In other words, if other devices are placed around a heat-generating device, excessive heat will be transferred, preventing adequate cooling and resulting in a vicious cycle. *For more detailed information, you can view the related links. For more details, please download the PDF or feel free to contact us.
- 企業：アイガ電子工業
- 価格：Other
